Fabrication and Characterization of Ultra‐Lightweight, Compact, and Flexible Thermoelectric Device Based on Highly Refined Chip Mounting-Reference-Cited by-同舟云学术

Fabrication and Characterization of Ultra‐Lightweight, Compact, and Flexible Thermoelectric Device Based on Highly Refined Chip Mounting

Published:2020-03-18 Issue:5 Volume:5 Page:1901128
ISSN:2365-709X
Container-title:Advanced Materials Technologies
language:en
Short-container-title:Adv. Mater. Technol.

Author:

Ekubaru Yusufu¹^ORCID,Sugahara Tohru¹,Ibano Kenzo²,Suetake Aiji¹,Tsurumoto Maki¹,Kagami Noriko¹,Suganuma Katsuaki¹

Affiliation:

1. Department of Advanced Interconnection Materials The Institute of Scientific and Industrial Research Osaka University Mihogaoka 8‐1 Ibaraki Osaka 567‐0047 Japan

2. Division of Electrical Electronic and Information Engineering Graduate School of Osaka University Yamadaoka 2‐1 Suita Osaka 567‐0047 Japan

Funder

Japan Science and Technology Agency

Ministry of Education, Culture, Sports, Science and Technology

Publisher

Wiley

Subject

Industrial and Manufacturing Engineering,Mechanics of Materials,General Materials Science

Link

https://onlinelibrary.wiley.com/doi/pdf/10.1002/admt.201901128

Reference27 articles.

1. Thermoelectric generators for wearable body heat harvesting: Material and device concurrent optimization

2. Review of wearable thermoelectric energy harvesting: From body temperature to electronic systems

3. Progress and Perspective: Soft Thermoelectric Materials for Wearable and Internet‐of‐Things Applications

4. Green Biocomposites for Thermoelectric Wearable Applications

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