Application of Organic Gel on Skin Realized by Hydrogel/Organic Gel Adhesion

Author:

Hu Ziqing1,Tang Wei2ORCID,Ji Xiaofan1ORCID

Affiliation:

1. Key Laboratory of Materials Chemistry for Energy Conversion and Storage Ministry of Education Hubei Key Laboratory of Materials Chemistry and Service Failure Hubei Engineering Research Center for Biomaterials and Medical Protective Materials State Key Laboratory of Materials Processing and Die & Mould Technology School of Chemistry and Chemical Engineering Huazhong University of Science and Technology Wuhan 430074 China

2. Key Laboratory of Human‐Machine‐Intelligence Synergic System Research Center for Neural Engineering Shenzhen Institute of Advanced Technology Chinese Academy of Sciences Shenzhen Guangdong 518055 China

Abstract

AbstractDiversity in solvent selection bestows the organic gel with appealing characteristics embracing antidrying, anti‐icing, and antifouling abilities. However, organic gel, subjected to the “toxic” inherent property of solvent, is not able to be manipulated on skin. Herein, introducing the hydrogel layer amid organic gel and skin is envisaged to realize application of organic gel on skin. Hydrogel, inserted as the medium layer, works for the coupling role between skin and organic gel, also avoids the direct contact of organic gel toward skin. First, hydrogel system composed of acrylic acid is fabricated, meanwhile organic gel is prepared employing 2‐hydroxyethyl methacrylate, ethylene glycol (EG) as solvent. Organic gel is able to adhere to hydrogel by hydrogen bonding resulting from carboxyl groups of polyacrylic acid chains and hydroxyl groups occurring on 2‐hydroxyethyl methacrylate or EG. Additionally, hydrogen bonding enables the hydrogel to be firmly attached to skin, thus organic gel/hydrogel/skin assembly is produced. The further application of organic gel is exploited by incorporating stimuli‐responsive dyes including spiropyran and rhodamine derivative.

Funder

National Natural Science Foundation of China

Fundamental Research Funds for the Central Universities

Publisher

Wiley

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