The Heterogeneous Packaging of A 3 × 3 Mini‐LED Array for Smart Contact Lens Display Applications

Author:

Tsai Cheng‐Wei1,Yeh Guan‐Ting1,Hsu Shun‐Hsi1,Wu Shin‐Ho1,Huang Yu‐Hsuan1,Chiueh Herming1,Chiou Jin‐Chern1

Affiliation:

1. Institute of Electrical and Computer Engineering National Yang Ming Chiao Tung University, No. 1001, Ta‐ Hsueh Rd. Hsinchu Taiwan Taiwan, Republic of China

Abstract

For the needs of augmented reality (AR), virtual reality (VR) and mixed reality (MR), smart contact lenses (SCL) have become an important platform as a display source in the future consumer market. Accordingly, this paper demonstrates a display device based on contact lenses. This device integrates a 3 × 3 Mini‐LED display array, a micro antenna, and a driver and transmission chip and is packaged in a smart contact lens made of hydroxyethyl methacrylate (HEMA). It is note that in order to simultaneously meet the goals of wearing comfort, biocompatibility, wireless energy transmission and adjustable display functions, the final package thickness needs to be less than 200 μm. Here, we use heterogeneous packaging technology to connect the driver and transmission chip and the Mini‐LED display array with metal wires on the flexible substrate, and use metal wires on the same conductive layer to design the antenna required for wireless energy transmission. In order to complete the above functions, we use 920 MHz RFID technology as the energy source for wireless energy transmission. When the antenna of the RFID reader is 2 cm away from the smart contact lens, the designed receiving chip can receive 100 μW of energy. After converting this energy to DC 3 V, it can drive Mini‐LED with a current of about 30 μA, and the mini‐LED display array can be instantly controlled to display different contents by transmitting display commands through the RFID protocol. © 2024 Institute of Electrical Engineer of Japan and Wiley Periodicals LLC.

Funder

National Science and Technology Council

Publisher

Wiley

Subject

Electrical and Electronic Engineering

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