A silicon rubber composite with enhanced thermal conductivity and mechanical properties based on nanodiamond and boron nitride fillers-Reference-Cited by-同舟云学术

A silicon rubber composite with enhanced thermal conductivity and mechanical properties based on nanodiamond and boron nitride fillers

Published:2021-06-16 Issue:9 Volume:42 Page:4390-4396
ISSN:0272-8397
Container-title:Polymer Composites
language:en
Short-container-title:Polymer Composites

Author:

Qu Jiaying¹,Fan Lu¹,Mukerabigwi Jean Felix¹²,Liu Cui¹,Cao Yu¹^ORCID

Affiliation:

1. Key Laboratory of Pesticide & Chemical Biology of Ministry of Education, College of Chemistry Central China Normal University Wuhan People's Republic of China

2. Chemistry Department, School of Sciences College of Science and Technology, University of Rwanda Kigali Rwanda

Funder

Fundamental Research Funds for the Central Universities

Publisher

Wiley

Subject

Materials Chemistry,Polymers and Plastics,General Chemistry,Ceramics and Composites

Link

https://onlinelibrary.wiley.com/doi/pdf/10.1002/pc.26156

Reference29 articles.

1. Preparation of High-temperature Silicone Rubber Mold and its Application in Food Industry

2. Effects of rubber type on the curing and physical properties of silica filled rubber compounds

3. High thermal conductivity and high electrical resistivity of poly(vinylidene fluoride)/polystyrene blends by controlling the localization of hybrid fillers

4. Experimental and theoretical studies of effective thermal conductivity of composites made of silicone rubber and Al2O3 particles

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