Die attach using silver sintering. Practical implementation and analysis-Reference-Cited by-同舟云学术

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Die attach using silver sintering. Practical implementation and analysis

Published:2013-08-30 Issue:3-4 Volume:16 Page:293-305
ISSN:2103-3641
Container-title:European Journal of Electrical Engineering
language:
Short-container-title:E.J.E.E

Author:

Masson Amandine,Sabbah Wissam,Riva Raphaël,Buttay Cyril,Azzopradi Stephane,Morel Hervé,Planson Dominique,Meuret Régis

Publisher

International Information and Engineering Technology Association

Subject

Electrical and Electronic Engineering

Cited by 7 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Impact of chip-package parameters on the thermomechanical reliability of high thermal die attach materials in RF, power, and automotive applications;2024 IEEE 74th Electronic Components and Technology Conference (ECTC);2024-05-28

2. Understanding the Influence of Copper Substrate Oxidation on Silver Pressure Sintering Performance;2023 IEEE 73rd Electronic Components and Technology Conference (ECTC);2023-05

3. Thermal management and packaging of wide and ultra-wide bandgap power devices: a review and perspective;Journal of Physics D: Applied Physics;2023-02-16

4. Design of a test package for high voltage SiC diodes;2022 IEEE International Workshop on Integrated Power Packaging (IWIPP);2022-08-24

5. Study on the Ion Migration of Silver Ions from Aqueous Solution in Epoxy-Based Molding Compounds by TOF-SIMS Measurements;ECS Journal of Solid State Science and Technology;2022-02-01

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