Behavior Analysis of a Flexure Hinge Array

Author:

Le Chau Ngoc1,Tran Ngoc Thoai1,Dao Thanh-Phong23ORCID

Affiliation:

1. Faculty of Mechanical Engineering, Industrial University of Ho Chi Minh City, Ho Chi Minh City, Vietnam

2. Division of Computational Mechatronics, Institute for Computational Science, Ton Duc Thang University, Ho Chi Minh City, Vietnam

3. Faculty of Electrical & Electronics Engineering, Ton Duc Thang University, Ho Chi Minh City, Vietnam

Abstract

Compliant mechanisms have been well designed to reach an ultra-high accuracy in positioning systems. However, the displacement of compliant mechanisms is still a major problem that restricts practical applications. Hence, a new flexure hinge array (FHA) is proposed to improve its displacement in this article. This paper is aimed to design and optimize the FHA. The structure of FHA is constructed by series-parallel array. Analytical calculations of the FHA are derived so as to analyze the stiffness and deformation. The displacement of the FHA is optimized by moth-flame optimization algorithm. The results determined that optimal parameters are found at Lt1 of 20.58 mm, w t 1 of 1.92 mm, and w t 2 of 2.29 mm. Besides, the optimal displacement is about 27.02 mm. Through Kruskal–Wallis test, the results verified that the proposed MFO outperforms other optimization algorithms in terms of searching the largest displacement. Validations of the analytical models are verified through simulations and experiments. The theoretical results are close to the experimental results. Additionally, the displacement of the FHA is superior that of existing joints. The displacement in the z-direction is approximately 32 mm according to a displacement of 12 mm in the x-direction.

Funder

National Foundation for Science and Technology Development

Publisher

Hindawi Limited

Subject

General Engineering,General Mathematics

Cited by 1 articles. 订阅此论文施引文献 订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献

1. Sealing Design of Piezoelectric Jetting Dispenser and Its Influence on Jetting Performance;IEEE Transactions on Components, Packaging and Manufacturing Technology;2023-12

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