Thermomechanical behaviour of environmentally benign Pb-free solders
Author:
Publisher
Informa UK Limited
Subject
Materials Chemistry,Metals and Alloys,Mechanical Engineering,Mechanics of Materials
Link
http://www.tandfonline.com/doi/pdf/10.1179/174328009X461069
Reference124 articles.
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4. R. R. Tummala and E. J. Rymaszewski: ‘Microelectronics packaging handbook’; 1989, New York, van Norstrand Reinhold.
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