Author:
Veilleux B.,Lafront A.-M.,Ghali E.
Subject
Industrial and Manufacturing Engineering,Metals and Alloys
Reference20 articles.
1. Nodulation of electrodeposited copper in the presence of thiourea
2. Influence of Some Bath Additives on the Passivation of Copper Anodes in CuSO4–H2SO4Electrolyte
3. O. Forsen, Copper '90 Refining, Fabrication, Markets, Sweden, 1-3 October 1990, pp. 189–197.
4. B.E. Langer and P. Stanke, EPD Congress, The Minerals, Metals and Materials Society, 1995, pp. 559–569.
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