Role of SPS in chloride ions and PEG additive system for copper electrocrystallisation
Author:
Publisher
Informa UK Limited
Subject
Metals and Alloys,Surfaces, Coatings and Films,Surfaces and Interfaces,Mechanics of Materials,Condensed Matter Physics
Link
http://www.tandfonline.com/doi/pdf/10.1179/174591910X12692576434572
Reference26 articles.
1. Curvature enhanced adsorbate coverage mechanism for bottom-up superfilling and bump control in damascene processing
2. Additive Behavior during Copper Electrodeposition in Solutions Containing Cl[sup −], PEG, and SPS
3. Effects of Additives on Copper Electrodeposition in Submicrometer Trenches
4. The chemistry of additives in damascene copper plating
5. Damascene copper electroplating for chip interconnections
Cited by 10 articles. 订阅此论文施引文献 订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献
1. Electrocrystallization and Morphology of Copper Coatings in the Presence of Organic Additives;Coatings;2023-11-05
2. Interaction of Bis-(sodium-sulfopropyl)-Disulfide and Polyethylene Glycol on the Copper Electrodeposited Layer by Time-of-Flight Secondary-Ion Mass Spectrometry;Molecules;2023-01-03
3. Periodic pulse reverse plating achieve high throwing power of high aspect ratio electronic interconnection: simulation and experiments;Ionics;2022-09-08
4. Hydrogen-Induced Grain Growth in Electrodeposited Cu Films;Journal of the Japan Institute of Metals;2015
5. Electrocrystallizations of copper on glassy carbon in CuCl2 silica sol and aqueous solutions;Chinese Chemical Letters;2012-02
1.学者识别学者识别
2.学术分析学术分析
3.人才评估人才评估
"同舟云学术"是以全球学者为主线，采集、加工和组织学术论文而形成的新型学术文献查询和分析系统，可以对全球学者进行文献检索和人才价值评估。用户可以通过关注某些学科领域的顶尖人物而持续追踪该领域的学科进展和研究前沿。经过近期的数据扩容，当前同舟云学术共收录了国内外主流学术期刊6万余种，收集的期刊论文及会议论文总量共计约1.5亿篇，并以每天添加12000余篇中外论文的速度递增。我们也可以为用户提供个性化、定制化的学者数据。欢迎来电咨询！咨询电话：010-8811{复制后删除}0370
www.globalauthorid.com
TOP
Copyright © 2019-2024 北京同舟云网络信息技术有限公司 京公网安备11010802033243号 京ICP备18003416号-3