Diffusion induced grain boundary migration-Reference-Cited by-同舟云学术

Diffusion induced grain boundary migration

Published:1987-01 Issue:1 Volume:32 Page:173-189
ISSN:0950-6608
Container-title:International Materials Reviews
language:en
Short-container-title:International Materials Reviews

Author:

King A. H.

Publisher

Informa UK Limited

Subject

Materials Chemistry,Metals and Alloys,Mechanical Engineering,Mechanics of Materials

Link

http://www.tandfonline.com/doi/pdf/10.1179/095066087790150304

Reference58 articles.

1. A New Type of Structure in the α-Copper-Zinc Alloys

2. Kinetics of thin‐film reactions between Pb and the AgPd alloy

3. Diffusion induced grain boundary migration

4. Diffusion-induced grain boundary migration and recrystallization, exemplified by the system CuZn

5. P. G. SHEWMON and G. meYlucx: in ‘Interface migration and control of microstructure’, (ed. C. S. Pande et al.), 7; 1986, Metals Park, Ohio, American Society for Metals.

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