Fabrication of three-dimensional microstructure by nickel plating and photolithography
Author:
Publisher
Informa UK Limited
Subject
Metals and Alloys,Surfaces, Coatings and Films,Surfaces and Interfaces,Mechanics of Materials,Condensed Matter Physics
Link
http://www.tandfonline.com/doi/pdf/10.1179/174591909X439388
Reference6 articles.
1. Formation of 3-Dimensional Structure by Electroforming
2. Leveling and Microstructural Effects of Additives for Copper Electrodeposition
3. Electrodeposition of Ni in Submicrometer Trenches
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