Author:
Leisner P.,Møller P.,Fredenberg M.,Belov I.
Subject
Metals and Alloys,Surfaces, Coatings and Films,Surfaces and Interfaces,Mechanics of Materials,Condensed Matter Physics
Reference4 articles.
1. P. Miöller, R. Pelzer, M. Fredenberg, P. Wiwen-Nilsson, L. Karlsson and D. Lee: Proc. EPTC 2004, Singapore, December 2004, IEEE Reliability, 294–297.
2. Metal printing of copper interconnects down to 500nm using ECPR – Electrochemical pattern replication
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24 articles.
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