Wafer Level Bonding Technology for 3D Stacked IC-Reference-Cited by-同舟云学术

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Wafer Level Bonding Technology for 3D Stacked IC

Published:2013-03-30 Issue:1 Volume:20 Page:7-13
ISSN:1226-9360
Container-title:Journal of the Microelectronics and Packaging Society
language:en
Short-container-title:Journal of the Microelectronics and Packaging Society

Author:

Cho Young Hak,Kim Sarah Eunkyung,Kim Sungdong

Publisher

The Korean Microelectronics and Packaging Society

Link

http://ocean.kisti.re.kr/downfile/crosscheck/ishm/JAKO201322836624763.pdf

Cited by 5 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Selective Atomic Layer Deposition of Co Thin Films Using Co(EtCp)2 Precursor;Korean Journal of Materials Research;2024-03-27

2. Wideband-Miniature MEMS Band Pass Filter of S-Band Switch Filter Bank used in Electronic Warfare;Journal of The Korean Institute of Defense Technology;2022-12

3. Research of Wafer Level Bonding Process Based on Cu–Sn Eutectic;Micromachines;2020-08-20

4. Effects of forming gas plasma treatment on low-temperature Cu–Cu direct bonding;Japanese Journal of Applied Physics;2016-05-27

5. Wafer level Cu–Cu direct bonding for 3D integration;Microelectronic Engineering;2015-04

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