Progress and prospects of super-filling in Damascene copper electroplating process-Reference-Cited by-同舟云学术

Progress and prospects of super-filling in Damascene copper electroplating process

Published:2023-09-01 Issue:10 Volume:53 Page:1880-1890
ISSN:1674-7224
Container-title:SCIENTIA SINICA Chimica
language:en
Short-container-title:Sci. Sin.-Chim

Author:

Wang Chong,Peng Yixiao,Li Jiujuan,Zhou Guoyun,Chen Yuanming,Wang Shouxu,He Wei

Publisher

Science China Press., Co. Ltd.

Subject

Materials Chemistry,General Chemical Engineering,Biochemistry,General Chemistry

Link

https://engine.scichina.com/doi/pdf/97D0D45A57BC4C7E92712B964A8123BF

Reference54 articles.

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