An initial investigation into active disassembly using shape memory polymers

Author:

Chiodo J D1,Harrison D J1,Billett E H1

Affiliation:

1. Brunel University Cleaner Electronics Research, Active Disassembly Using Smart Materials Egham, Surrey, UK

Abstract

The aim of the work was to demonstrate an alternative to conventional end-of-life (EOL) disassembly strategies such as robotic or hand dismantling. This initial investigation reports the disassembly of consumer electronic products using smart materials in the design of embedded releasable fasteners. A series of products was tested in a variety of different ways using shape memory polymers (SMPs). Tests were run on macroassemblies and subassemblies of telecommunications goods. The devices designed with SMP used two distinct properties of the material suited to active disassembly: the mechanical property loss (MPL), in this case a loss of rigidity in the thread of the SMP screws; the shape memory effect (SME), a change in form, resulting in this case in the loss of moulded thread from SMP shape memory effect screws. Once SMP components were developed and embedded into the candidate products, timed disassembly experiments were conducted. These tests used infrared, air jet and water bath methods for applying heat to trigger the SMP devices. Once the trigger temperature was reached, shape change and property loss occurred in the screws and brackets, allowing assembly release.

Publisher

SAGE Publications

Subject

Industrial and Manufacturing Engineering,Mechanical Engineering

Reference15 articles.

1. 3rd Draft Proposal for Directive on waste electrical and electronic equipment, 76/769/EEC, EU (European Union) DGXI, 1999.

2. Chiodo J. D., Billett E., Harrison D. Active disassembly. J. Sustainable Des., October 1998.

3. Chiodo J. D, Billett E., Harrison D. Preliminary investigations of active disassembly using shape memory polymers. In 1st IEEE International Symposium on Environmentally Conscious Design and Inverse Manufacturing (EcoDesign '99), Tokyo, Japan, 1–3 Feburary 1999, pp. 590–596.

4. Chiodo J. D., Billett E., Harrison D. Active disassembly using shape memory polymers for the mobile industry. In IEEE International Symposium on Electronics and the Environment (ISEE), Danvers, Massachusetts, 11–13 May 1999, pp. 151–156.

5. Chiodo J. D., Billett E., Harrison D. Shape memory alloy actuators for ADSM of consumer electronic products. In 38th Gateway Annual Conference of Metallurgists, Quebec City, Quebec, Canada, 22–26 August 1999, pp. 425–439.

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