An Efficient Method of DRC Violation Prediction with a Serial Deep Learning Model

Author:

Lin Jingui1ORCID,Lin Wenxiong2ORCID,Liang Shiyan2ORCID,Gao Peng3ORCID,Xing Yan3ORCID,Wu Tingting24ORCID,Xiong Xiaoming2ORCID,Cai Shuting2ORCID

Affiliation:

1. Automation, Guangdong University of Technology, Guangzhou, China

2. Guangdong University of Technology, Guangzhou, China

3. School of Integrated Circuits, Guangdong University of Technology, Guangzhou, China

4. The Hong Kong University of Science and Technology - Guangzhou Campus, Guangzhou, China

Abstract

In VLSI design, the utilization of Design Rule Check (DRC) tools in the early stage is crucial for predicting and resolving violations, thereby expediting the physical design process. In our study, we present an efficient model that predicts DRC violations prior to the routing stage. Additionally, our model incorporates a sliding window technique to enhance the feature extraction process. We extract structural features using GCN networks and utilize feature reuse techniques to fully recover the lost information in neural layers, which serves as input to the CNN model, resulting in more accurate hotspot prediction. The experimental results demonstrate that our model successfully identifies 95.78% of DRC violations, with a mere 4.17% false alarm rate. Not only does our method deliver improved feature preprocessing results, but it also enhances prediction accuracy compared to alternative approaches.

Publisher

Association for Computing Machinery (ACM)

Reference12 articles.

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3. PROS 2.0: A Plug-In for Routability Optimization and Routed Wirelength Estimation Using Deep Learning;Chen Jingsong;IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems,2023

4. A learning-based methodology for routability prediction in placement

5. Xuan Chen, Zhi-Xiong Di, Wei Wu, Quan-Yuan Feng, and Jiang-Yi Shi. 2020. Detailed Routing Short Violations Prediction Method Using Graph Convolutional Network. In 2020 IEEE 15th International Conference on Solid-State & Integrated Circuit Technology. IEEE, Kunming, China, 1–3.

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