Author:
Kim Dae Hyun,Athikulwongse Krit,Lim Sung Kyu
Cited by
35 articles.
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1. Analysis of the Resistance of TSV in TSV-Based Inductors with Air Core;2023 IEEE 6th International Conference on Electronic Information and Communication Technology (ICEICT);2023-07-21
2. Impact analysis of virtual channels and Buffers on different Network-on-chip configurations;2022 IEEE International Symposium on Smart Electronic Systems (iSES);2022-12
3. Pseudo-3D Physical Design Flow for Monolithic 3D ICs: Comparisons and Enhancements;ACM Transactions on Design Automation of Electronic Systems;2021-06-05
4. Intelligent design automation for 2.5/3D heterogeneous SoC integration;Proceedings of the 39th International Conference on Computer-Aided Design;2020-11-02
5. Iterative Application Mapping with TSV Placement Strategy for Design a 3D NoC-Based Multi-Core Systems;Design and Test Strategies for 2D/3D Integration for NoC-based Multicore Architectures;2019-12-21