Quantifying the relationship between the power delivery network and architectural policies in a 3D-stacked memory device-Reference-Cited by-同舟云学术

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Quantifying the relationship between the power delivery network and architectural policies in a 3D-stacked memory device

Published:2013 Issue: Volume: Page:
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Container-title:Proceedings of the 46th Annual IEEE/ACM International Symposium on Microarchitecture - MICRO-46
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Author:

Shevgoor Manjunath,Kim Jung-Sik,Chatterjee Niladrish,Balasubramonian Rajeev,Davis Al,Udipi Aniruddha N.

Publisher

ACM Press

Cited by 26 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. SuperCut;Proceedings of the 20th ACM International Conference on Computing Frontiers;2023-05-09

2. High-Performance and Power-Saving Mechanism for Page Activations Based on Full Independent DRAM Sub-Arrays in Multi-Core Systems;IEEE Access;2023

3. AgileWatts: An Energy-Efficient CPU Core Idle-State Architecture for Latency-Sensitive Server Applications;2022 55th IEEE/ACM International Symposium on Microarchitecture (MICRO);2022-10

4. Characterization and Mitigation of Electromigration Effects in TSV-Based Power Delivery Network Enabled 3D-Stacked DRAMs;Proceedings of the 2021 on Great Lakes Symposium on VLSI;2021-06-22

5. Graph processing and machine learning architectures with emerging memory technologies: a survey;Science China Information Sciences;2021-05-10

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