TetraForce: A Magnetic-Based Interface Enabling Pressure Force and Shear Force Input Applied to Front and Back of a Smartphone

Author:

Tsuchida Taichi1ORCID,Fujita Kazuyuki1ORCID,Ikematsu Kaori2ORCID,Sarcar Sayan3ORCID,Takashima Kazuki1ORCID,Kitamura Yoshifumi1ORCID

Affiliation:

1. Tohoku University, Sendai, Japan

2. Yahoo, Tokyo, Japan / Tohoku University, Sendai, Japan

3. Birmingham City University, Birmingham, UK

Abstract

We propose a novel phone-case-shaped interface named TetraForce, which enables four types of force input consisting of two force directions (i.e., pressure force and shear force) and two force-applied surfaces (i.e., touch surface and back surface) in a single device. Force detection is achieved using the smartphone's built-in magnetometer (and supplementary accelerometer and gyro sensor) by estimating the displacement of a magnet attached to a 3-DoF passively movable panel at the back. We conducted a user study (N=12) to investigate the fundamental user performance by our interface and demonstrated that the input was detected as intended with a success rate of 97.4% on average for all four input types. We further conducted an ideation workshop with people who were involved in human-computer interaction (N=12) to explore possible applications of this interface, and we obtained 137 ideas for applications using individual input types and 51 possible scenarios using them in combination. Organizing these ideas reveals the advantages of each input type and suggests that our interface is useful for applications that require complex operations and that it can improve intuitiveness through elastic feedback.

Funder

JSPS Grants KAKENHI

Publisher

Association for Computing Machinery (ACM)

Subject

Computer Networks and Communications,Human-Computer Interaction,Social Sciences (miscellaneous)

Cited by 1 articles. 订阅此论文施引文献 订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献

1. Acoustic+Pose: Adding Input Modality to Smartphones with Near-Surface Hand-Pose Recognition using Acoustic Surface;Proceedings of the 2023 International Symposium on Wearable Computers;2023-10-08

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