TherModule

Author:

Maeda Tomosuke1,Kurahashi Tetsuo2

Affiliation:

1. Toyota Central R&D Labs., Inc., Human Science Research Domain, Nagakute, Aichi

2. Toyota Central R&D Labs., Inc, Human Science Research Domain, Nagakute, Aichi

Publisher

ACM

Cited by 20 articles. 订阅此论文施引文献 订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献

1. Body Transformation: An Experiential Quality of Sensory Feedback Wearables for Altering Body Perception;Proceedings of the Eighteenth International Conference on Tangible, Embedded, and Embodied Interaction;2024-02-11

2. ThermoFeet: Assessing On-Foot Thermal Stimuli for Directional Cues;Proceedings of the 22nd International Conference on Mobile and Ubiquitous Multimedia;2023-12-03

3. Non-Contact Thermal Haptics for VR;Adjunct Proceedings of the 2023 ACM International Joint Conference on Pervasive and Ubiquitous Computing & the 2023 ACM International Symposium on Wearable Computing;2023-10-08

4. Thermal Cues Composed of Sequences of Pulses for Transferring Data via a Haptic Thermal Interface;Bioengineering;2023-10-02

5. The Dark Side of Augmented Reality: Exploring Manipulative Designs in AR;International Journal of Human–Computer Interaction;2023-03-27

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