Author:
Goplen Brent,Sapatnekar Sachin
Cited by
37 articles.
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1. System-Level Analysis of 3D ICs with Thermal TSVs;ACM Journal on Emerging Technologies in Computing Systems;2018-11
2. The Future of CMOS: More Moore or a New Disruptive Technology?;Advanced Nanoelectronics;2018-10-05
3. Anisotropic equivalent thermal conductivity model for efficient and accurate full-chip-scale numerical simulation of 3D stacked IC;International Journal of Heat and Mass Transfer;2018-05
4. Xylem;Proceedings of the 50th Annual IEEE/ACM International Symposium on Microarchitecture;2017-10-14
5. Modeling and Analysis of Transient Heat for 3D IC;Communications in Computer and Information Science;2017