SIAM: Chiplet-based Scalable In-Memory Acceleration with Mesh for Deep Neural Networks

Author:

Krishnan Gokul1,Mandal Sumit K.2,Pannala Manvitha1,Chakrabarti Chaitali1,Seo Jae-Sun1,Ogras Umit Y.2,Cao Yu1

Affiliation:

1. Arizona State University, Tempe, AZ, USA

2. University of Wisconsin-Madison, Madison, WI, USA

Abstract

In-memory computing (IMC) on a monolithic chip for deep learning faces dramatic challenges on area, yield, and on-chip interconnection cost due to the ever-increasing model sizes. 2.5D integration or chiplet-based architectures interconnect multiple small chips (i.e., chiplets) to form a large computing system, presenting a feasible solution beyond a monolithic IMC architecture to accelerate large deep learning models. This paper presents a new benchmarking simulator, SIAM, to evaluate the performance of chiplet-based IMC architectures and explore the potential of such a paradigm shift in IMC architecture design. SIAM integrates device, circuit, architecture, network-on-chip (NoC), network-on-package (NoP), and DRAM access models to realize an end-to-end system. SIAM is scalable in its support of a wide range of deep neural networks (DNNs), customizable to various network structures and configurations, and capable of efficient design space exploration. We demonstrate the flexibility, scalability, and simulation speed of SIAM by benchmarking different state-of-the-art DNNs with CIFAR-10, CIFAR-100, and ImageNet datasets. We further calibrate the simulation results with a published silicon result, SIMBA. The chiplet-based IMC architecture obtained through SIAM shows 130 and 72 improvement in energy-efficiency for ResNet-50 on the ImageNet dataset compared to Nvidia V100 and T4 GPUs.

Funder

Semiconductor Research Corporation

Publisher

Association for Computing Machinery (ACM)

Subject

Hardware and Architecture,Software

Reference46 articles.

Cited by 21 articles. 订阅此论文施引文献 订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献

1. ELEMENT: Energy-Efficient Multi-NoP Architecture for IMC-Based 2.5-D Accelerator for DNN Training;IEEE Design & Test;2023-12

2. HyDe: A Hybrid PCM/FeFET/SRAM Device-Search for Optimizing Area and Energy-Efficiencies in Analog IMC Platforms;IEEE Journal on Emerging and Selected Topics in Circuits and Systems;2023-12

3. End-to-End Benchmarking of Chiplet-Based In-Memory Computing;Neuromorphic Computing;2023-11-15

4. SpikeSim: An End-to-End Compute-in-Memory Hardware Evaluation Tool for Benchmarking Spiking Neural Networks;IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems;2023-11

5. In-Memory Computing for AI Accelerators: Challenges and Solutions;Embedded Machine Learning for Cyber-Physical, IoT, and Edge Computing;2023-10-01

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