Coupling extraction and optimization for heterogeneous 2.5D chiplet-package co-design
Author:
Affiliation:
1. University of Arkansas
2. Mentor Graphics
Funder
National Science Foundation
Publisher
ACM
Link
https://dl.acm.org/doi/pdf/10.1145/3400302.3415718
Reference14 articles.
1. Embedded Wafer Level Ball Grid Array (eWLB)
2. OpenRAM: an open-source memory compiler
3. Chiplet-Package Co-Design For 2.5D Systems Using Standard ASIC CAD Tools
4. Chip Stackable, Ultra-thin, High-Flexibility 3D FOWLP (3D SWIFT® Technology) for Hetero-Integrated Advanced 3D WL-SiP
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1. Review of chiplet-based design: system architecture and interconnection;Science China Information Sciences;2024-07-19
2. Challenges and Opportunities to Enable Large-Scale Computing via Heterogeneous Chiplets;2024 29th Asia and South Pacific Design Automation Conference (ASP-DAC);2024-01-22
3. Monad: Towards Cost-Effective Specialization for Chiplet-Based Spatial Accelerators;2023 IEEE/ACM International Conference on Computer Aided Design (ICCAD);2023-10-28
4. Cross-Boundary Inductive Timing Optimization for 2.5D Chiplet-Package Co-Design;Proceedings of the 2021 on Great Lakes Symposium on VLSI;2021-06-22
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