Using Permanent and Temporary Polyimide Adhesives in 3D-TSV Processing to Avoid Thin Wafer Handling

Abstract

3D chip integration processes use thinned silicon wafers in conjunction with through silicon vias. Polyimide adhesives are evaluated for use as temporary and permanent adhesives to enable handling of thinned wafers and subsequent bonding into 3D stacks. These adhesives are found to have a combination of thermal and mechanical properties and processing capabilities required for 3D chip integration applications.