Critical Issues of TSV and 3D IC Integration

Abstract

Moore's law has been the most powerful driver for the development of the microelectronic industry. This law is grounded in lithography scaling and integration (in 2D) of all functions on a single chip, perhaps through system-on-chip (SoC). On the other hand, the integration of all these functions can be achieved through system-in-package (SiP) or, ultimately, 3D IC integration. However, there are many critical issues for 3D IC integration. In this study, some of the critical issues will be discussed and some potential solutions or research problems will be proposed.