Effect of grit shape and crystal structure on damage in diamond wire scribing of silicon-Reference-Cited by-同舟云学术

Effect of grit shape and crystal structure on damage in diamond wire scribing of silicon

Published:2017-01-23 Issue:4 Volume:100 Page:1350-1359
ISSN:0002-7820
Container-title:Journal of the American Ceramic Society
language:en
Short-container-title:J Am Ceram Soc

Author:

Kumar Arkadeep¹,Melkote Shreyes N.¹,Kaminski Steffi²,Arcona Chris²

Affiliation:

1. George W. Woodruff School of Mechanical Engineering Georgia Institute of Technology Atlanta Georgia

2. Saint‐Gobain Innovative Materials Northboro R&D Center Northborough Massachusetts

Funder

Division of Civil, Mechanical and Manufacturing Innovation

National Science Foundation

Publisher

Wiley

Subject

Materials Chemistry,Ceramics and Composites

Link

https://onlinelibrary.wiley.com/doi/pdf/10.1111/jace.14732

Reference37 articles.

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2. Basic Mechanisms and Models of Multi-Wire Sawing

3. Mechanisms of wafer sawing and impact on wafer properties

4. Effect of wear of diamond wire on surface morphology, roughness and subsurface damage of silicon wafers

5. CaiE TangB FahrnerWR ZhouL Characterization of the surfaces generated by diamond cutting of crystalline silicon 26th European Photovoltaic Solar Energy Conference and Exhibition 1884 – 86;2011.

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