Interfacial Reaction between Titanium Thin Films and Aluminum Nitride Substrates-Reference-Cited by-同舟云学术

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Interfacial Reaction between Titanium Thin Films and Aluminum Nitride Substrates

Published:2004-12-21 Issue:6 Volume:82 Page:1547-1552
ISSN:0002-7820
Container-title:Journal of the American Ceramic Society
language:en
Short-container-title:

Author:

Imanaka Yoshihiko,Notis Michael R.

Publisher

Wiley

Subject

Materials Chemistry,Ceramics and Composites

Link

http://onlinelibrary.wiley.com/wol1/doi/10.1111/j.1151-2916.1999.tb01953.x/fullpdf

Reference46 articles.

1. Development of Nitrogen Ceramics;Komeya;Am. Ceram. Soc. Bull.,1984

2. Translucent AlN Ceramic Substrate;Kuramoto;IEEE Trans. Compon., Hybrids, Manuf. Technol.,1986

3. AlN Substrates with High Thermal Conductivity;Kurokawa;IEEE Trans. Compon., Hybrids, Manuf. Technol.,1985

4. Processability of Thin-Film, Fine-Line Pattern on Aluminum Nitride Substrates;Chanchani;IEEE Trans. Compon., Hybrids, Manuf. Technol.,1988

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1. Aluminum nitride‐based ceramics with excellent thermal shock resistances;Journal of the American Ceramic Society;2024-04-05

2. The influence of columnar microstructure on diffusion reaction between Ti thin films and aluminum nitride ceramics;Surface and Coatings Technology;2019-12

3. Reactive chemical vapor deposition of heteroepitaxial Ti1−xAlxN films;CrystEngComm;2018

4. Effects of nitrogen vacancies on phase stability and mechanical properties of arc deposited (Ti 0.52 Al 0.48 )N y (y < 1) coatings;Surface and Coatings Technology;2017-12

5. Solid state formation of Ti 4 AlN 3 in cathodic arc deposited (Ti 1−x Al x )N y alloys;Acta Materialia;2017-05

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