Temperature Dependence of the Thermal Diffusivity/Conductivity of Aluminum Nitride-Reference-Cited by-同舟云学术

Temperature Dependence of the Thermal Diffusivity/Conductivity of Aluminum Nitride

Published:1990-08 Issue:8 Volume:73 Page:2511-2514
ISSN:0002-7820
Container-title:Journal of the American Ceramic Society
language:en
Short-container-title:J American Ceramic Society

Author:

Jackson T. Barrett,Donaldson Kimberly Y.,Hasselman D. P. H.

Publisher

Wiley

Subject

Materials Chemistry,Ceramics and Composites

Link

http://onlinelibrary.wiley.com/wol1/doi/10.1111/j.1151-2916.1990.tb07622.x/fullpdf

Reference10 articles.

1. A1N Substrates with High Thermal Conductivity

2. 4N. Kuramoto, H. Taniguchi, and I. Aso , "Sintering and Properties of High-Purity AIN Ceramics "; presented at International Symposium on Ceramic Substrates and Packages, Denver, CO. 1988 .

3. 5"Measurement of Thermal Conductivity of SHAPAL AlN Substrate ," Technical Bulletin, Tokuyama Soda, Ltd., Tokyo, Japan, 1987 .

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