1. W. A. Vitrio R. L. Brown Process for Fabricating Dimensionally Stable Interconnect Boards, 1987
2. K. R. Mikeska D. T. Schaefer Method for Reducing Shrinkage during Firing of Ceramic Bodies, 1994
3. LTCC-M: An Enabling Technology for High Performance Multilayer RF Systems;Geller;J. Microwave,1999
4. Constrained-Film Sintering of a Borosilicate Glass: In-Situ Measurement of Film Stress;Bang;J. Am. Ceram. Soc.,1995
5. Deposition and Sintering of Particle Films on a Rigid Substrate;Garino;J. Am. Ceram. Soc.,1987