Affiliation:
1. School of Engineering, The University of Tokyo
Publisher
Institute of Electrical Engineers of Japan (IEE Japan)
Subject
Electrical and Electronic Engineering,Mechanical Engineering
Reference44 articles.
1. (1) M. Esashi : “Wafer level packaging of MEMS”, J. Micromech. Microeng., Vol. 18, 073001 (2008)
2. (4) G. Longoni, A. Cone, M. Amiotti, A. Renzo, M. Moraja, and W. Reinert : “Q-factor enhancement for MEMS devices: the role of the getter film”, International Symposium on Microelectronics 2005, pp. 801-809 (2005)
3. (5) L. Lin, R. T. Howe, and A. P. Pisano : “Microelectromechanical filters for signal processing”, Journal of Microelectromechanical Systems, Vol. 7, No. 3, pp. 286-294 (1998)
4. (6) M. A. Schmidt : “Wafer-to-wafer bonding for microstructure formation”, Proc. IEEE, Vol. 86, No. 8, pp. 1575-1585 (1998)
5. (7) J.-Y. Chen, L.-S. Huang, C.-H. Chu, and C. Peizen : “A new transferred ultra-thin silicon micropackaging”, J. Micromech. Microeng., Vol. 12, pp. 406-409 (2002)
Cited by
3 articles.
订阅此论文施引文献
订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献