Through-Hole Interconnections Filled with Au-Sn Solder by Molten Metal Suction Method-Reference-Cited by-同舟云学术

Through-Hole Interconnections Filled with Au-Sn Solder by Molten Metal Suction Method

Published:2004 Issue:1 Volume:124 Page:1-6
ISSN:1341-8939
Container-title:IEEJ Transactions on Sensors and Micromachines
language:en
Short-container-title:IEEJ Trans. SM

Author:

Yamamoto Satoshi¹,Suemasu Tatsuo¹,Itoi Kazuhisa¹,Wada Hideyuki¹,Takizawa Takashi¹

Affiliation:

1. Electron Device Laboratory, Fujikura Ltd.

Publisher

Institute of Electrical Engineers of Japan (IEE Japan)

Subject

Electrical and Electronic Engineering,Mechanical Engineering

Link

http://www.jstage.jst.go.jp/article/ieejsmas/124/1/124_1_1/_pdf

Reference15 articles.

1. (1) M. Umemoto, K. Tanida, Y. Tomita, T. Ando, and K. Takahashi : “Super-Fine pitch Non-metallurgical bonding with NCP on the Three-dimensional Stacked LSI”, Proc. of MES 2002, pp. 55-58 (in Japanese)

2. (2) K. Okumura and N. Hayasaka : “Genuine Techno-logies for Tree-Dimensional (3D) LSI”, Proc. of SSDM, Nagoya, Japan, September 17-20, pp. 312-313 (2002)

3. (3) K. Tanida, Y. Tomita, T. Morifuji, T. Ando, R. Kajiwara, N. Tanaka, T. Sato, K. Takahashi, and M. Bonkohara : “Superfine Flip Chip Interconnections in 20μm-pitch”, Proc. of 2002 International Conference on Electronics Packaging (ICEP), Tokyo, Japan, April 17-19, pp. 333-338 (2002)

4. (4) Proc. of the 16th JIEP Annual Meeting, pp. 307-308 (in Japanese)

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