Affiliation:
1. School of Electrical and Electronic Engineering, Nanyang Technological University
2. Applied Technology Group, Rolls-Royce Singapore Pte. Ltd.
Publisher
Institute of Electrical Engineers of Japan (IEE Japan)
Subject
Electrical and Electronic Engineering,Industrial and Manufacturing Engineering,Mechanical Engineering,Energy Engineering and Power Technology,Automotive Engineering
Reference17 articles.
1. (1) K. Ma: “Electro-thermal model of power semiconductors dedicated for both case and junction temperature estimation”, in Power Electronics for the Next Generation Wind Turbine System, Switzerland: Springer, ch. 10, pp. 139-143 (2015)
2. (2) Infineon Technologies: “IPOSIM”, [Online]. Available: http://infineon.transim.com/iposim/
3. (3) SEMKIRON International: “SEMISEL simulation”, [Online]. Available: http://www.semikron.com
4. (4) A. Patel, S. Joshi, H. Chandwani, V. Patel, and K. Patel: “Estimation of junction temperature and power loss of IGBT used in VVVF inverter using numerical solution from data sheet parameter”, Int. J. Comput. Commun. Inf. Syst., Vol. 2, No. 1, pp. 17-22 (2010)
5. (5) Y. Zhang and Y. C. Liang: “A simple approach on junction temperature estimation for SiC MOSFET dynamic operations within safe operating area”, in Proc. Energy Convers. Congr. and Expo., pp. 5704-5707 (2015)
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