Interfacial reactions and mechanical strength of Sn-3.0Ag-0.5Cu/0.1㎛-Ni thin ENEPIG solder joint
Author:
Funder
Ministry of Trade, Industry and Energy
Publisher
The Korean Welding and Joining Society
Link
http://e-jwj.org/upload/jwj-35-6-51.pdf
Reference16 articles.
1. Solderability of thin ENEPIG plating Layer for Fine Pitch Package application
2. Effect of Plasma Surface Finish on Wettability and Mechanical Properties of SAC305 Solder Joints
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