Simulation of Riveting Process on PCB and Comparison with Strain Gauge Measurements

Author:

Krishna Vikram,Faller David,Andibur Roman,Palaparthi Kishore,Deckhardt Celina,Gurudatt PhD Balepur

Publisher

SAE International

Reference7 articles.

1. “Printed Wiring Board Strain Gage Test Guideline,” IPC/JEDEC-9704 Association Connecting Electronics Industries, June 2005.

2. Rans, C.D., Alderliesten, R.C., and Straznicky, P.V. , “Modelling of the Rivet Forming Process in Aluminum and GLARE for Design against Fatigue,” in Proceedings of the 23rd Symposium of the International Committee on Aeronautical Fatigue, Vol. 2, Deutsche Gesellschaft für Luft-und Raumfahrt-Lilienthal-Oberth eV, Bonn, Germany, 2005.

3. Mucha, J., Kaščák, L.’u., and Spišák, E. , “The Experimental Analysis of Forming and Strength of Clinch Riveting Sheet Metal Joint Made of Different Materials,” Advances in Mechanical Engineering 5 (2013): 848973.

4. Moore, J., Nelson, S.T., and Van Nguyen, H. , Spider clip for securing a circuit board within a communications module. US Patent 8,218,335, July 10, 2012.

5. Filman, R.Y., and Solomon, T. , Clip contact for easy installation of printed circuit board PCB. US Patent 9,011,164, April 21, 2015.

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