Full-field high-resolution terahertz imaging based on a high-resistance silicon solid immersion lens

Abstract

The spatial resolution of the direct imaging system depends on the wavelength and the numerical aperture. In the terahertz (THz) waveband, the wavelength is relatively large, and the higher numerical aperture of the imaging system usually promises the possibility of achieving higher spatial resolution. Solid immersion technique is an effective method to expand the numerical aperture. We design and fabricate a hemisphere lens with high-resistance silicon to achieve the effect of solid immersion, and obtain full-field, high-resolution focal-plane imaging. The characteristics of the direct refraction imaging and the secondary reflection imaging are analyzed by ray-tracing calculations. And the field curvature of the equivalent object plane and the spot diagram on the vertical image plane of the lens are quantifiably evaluated. It is shown that the secondary reflection imaging can effectively reduce the geometric distortion and achieve more ideal imaging quality. The method of blocking different regions before and after the solid immersion lens is proposed to obtain a clear magnified image of a two-dimensional grating with the period of 300 µm. This method provides a powerful tool for THz full-field microscopic imaging.