Abstract
A continuous, single shot roller transfer printing process is presented for the large-scale hybrid integration of semiconductor devices. Transfer of a 320 × 240 pixel micro-LED array, representing >75,000 individual devices in a single shot with sub-micron relative position accuracy is demonstrated. The transfer printing process preserves the array geometry with pixel spatial location error less than 1 µm deviation from the as-designed layout. An automated sub-micron precision metrology system based on simple optical microscopy was developed to asses such large device populations and allow the assessment of yield.
Funder
Fraunhofer UK
Royal Academy of Engineering
Innovate UK
Engineering and Physical Sciences Research Council
Subject
Electronic, Optical and Magnetic Materials
Cited by
3 articles.
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