Affiliation:
1. National University of Defense Technology
2. Hu’nan Key Laboratory of Ultra-precision Machining Technology
Abstract
With the application spectrum moving from infrared to visible light, aluminum optics with complex forms are difficult to fabricate by the majority of existing processing methods. Possessing the highest machining precision and low processing contamination, ion beam figuring (IBF) is a better method for fabrication of aluminum optics. However, the surface roughness deteriorates with the removal depth during IBF. In this study, the extra material removal during the IBF process is studied systematically. Extra material removal consists of two parts, determined by the convolution process and the limitation of the dynamic performance of machining tools. Extra material removal can be reduced by filtering out the surface residual error with a spatial frequency higher than the cut-off frequency and reducing the iterations of the machining process. Then, the executability of the dwell time matrix and the figuring ability of the removal function are analyzed. Adjusting the working parameters (volume removal rate) reduces the requirements for dynamic performance of machining tools. Finally, a minimal material removal processing strategy for aluminum optics based on power spectral density analysis and a spatial frequency filtering method is proposed. A simulation is conducted to verify the feasibility of the proposed strategy. With the same final precision (59.8 nm PV and 4.4 nm RMS), the maximum material removal decreases nearly 36 nm by applying the strategy, which reduces roughness nearly 10 nm. This study promotes the application of IBF in the field of aluminum optics fabrication as well as improves the machining precision of aluminum optics.
Funder
Major Programs of the National Natural Science Foundation of China
National Natural Science Foundation of China
the Postgraduate Scientific Innovation Fund of Hunan Province
Subject
Atomic and Molecular Physics, and Optics,Engineering (miscellaneous),Electrical and Electronic Engineering