End point prediction in wet etching, cleaning, and rinsing of microstructures in semiconductor manufacturing
Author:
Funder
Intel Corp
Publisher
Elsevier BV
Subject
Engineering (miscellaneous),Environmental Engineering
Reference17 articles.
1. Reliability improvement of Cu/low-k interconnects by integrating novel single pass single wafer wet clean;Chang,2005
2. Rinsing of high-aspect-ratio features on patterned wafers;Chiang;IEEE Trans. Semicond. Manuf.,2016
3. Dynamics of cleaning and rinsing of micro and nano structures in single-wafer cleaning tools;Dhane;IEEE Trans. Semicond. Manuf.,2010
4. Computer modeling of surface interactions and contaminant transport in microstructures during the rinsing of patterned semiconductor wafers;Dodge;Comput. Chem. Eng.,2014
5. Quantifying spatiotemporal impacts of the interaction of water scarcity and water use by the global semiconductor manufacturing industry;Frost;Water Resour. Industr.,2019
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