Mechanism of nodular growth in copper electrorefining with the inclusion of impurity particles under natural convection
Author:
Publisher
Elsevier BV
Subject
Materials Chemistry,Metals and Alloys,Industrial and Manufacturing Engineering
Reference29 articles.
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4. Concentration profile of CuSO4 in the cathodic diffusion layer;Awakura;J. Electrochem. Soc.,1976
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