Mixed-mode fracture of compacted tailing soils. II: Crack properties from full-field displacement fields
Author:
Publisher
Elsevier BV
Subject
Applied Mathematics,Mechanical Engineering,Condensed Matter Physics,General Materials Science
Reference56 articles.
1. Mixed-mode fracture of compacted tailing soils. I: Fracture toughness;Zhang;Theor. Appl. Fract. Mech.,2022
2. Utilizing digital image correlation (DIC) in asphalt pavement testing;Safavizadeh;J. Test. Eval.,2017
3. Application of digital image correlation (DIC) in dynamic notched semi-circular bend (NSCB) tests;Gao;Exp. Mech.,2015
4. Quantifying crack tip displacement fields with DIC;Yates;Eng. Fract. Mech.,2010
5. Measurement of mixed-mode fracture characteristics of an epoxy-based adhesive using a hybrid digital image correlation (DIC) and finite elements (FE) approach;Owens;Opt. Lasers Eng.,2021
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