Size effect on heat conduction and associate thermal fracture behavior of thin ceramic plates-Reference-Cited by-同舟云学术

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Size effect on heat conduction and associate thermal fracture behavior of thin ceramic plates

Published:2021-06 Issue: Volume:113 Page:102951
ISSN:0167-8442
Container-title:Theoretical and Applied Fracture Mechanics
language:en
Short-container-title:Theoretical and Applied Fracture Mechanics

Author:

Xue Zhangna,Tian Xiaogeng,Luan Yalin,Liu Jianlin

Funder

China Postdoctoral Science Foundation

National Natural Science Foundation of China

Publisher

Elsevier BV

Subject

Applied Mathematics,Mechanical Engineering,Condensed Matter Physics,General Materials Science

Reference34 articles.

1. A study of the mechanism of formation and numerical simulations of crack patterns in ceramics subjected to thermal shock;Jiang;Acta Mater.,2012

2. Recent progress in Zr(Hf)B2 based ultrahigh temperature ceramics;Ghosh,2013

3. Observation of ceramic cracking during quenching;Shao;J. Am. Ceram. Soc.,2017

4. Characterization models for thermal shock resistance and fracture strength of ultra-high temperature ceramics at high temperatures;Wang;Theor. Appl. Fract. Mec.,2017

5. Crack problem for a functionally graded layer on an elastic foundation;Kadioğlu;Int. J. Fracture,1998

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