Thermomechanical Reliability of Microelectronic Packaging-Reference-Cited by-同舟云学术

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Thermomechanical Reliability of Microelectronic Packaging

Published:2003 Issue: Volume: Page:219-239
ISSN:
Container-title:Comprehensive Structural Integrity
language:
Short-container-title:

Author:

Qu J.

Publisher

Elsevier

Reference49 articles.

1. Mechanics of adhesive failure I;Andrews;Proc. Roy. Soc., London,1973

2. Fundamentals of adhesion: the utility of three-liquid probe method;Azimi,1995

3. Principles and Applications of Tribology;Bhushan,1999

4. Adhesion in bonded aluminum joints for aircraft construction;Brockmann;Int. J. Adhesion & Adhesives,1986

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1. The Influence of Fundamental Processing Parameters of Ultrasonic Shot Peening on Surface Characteristics of 7B50-T7751 Alloy;SAE Technical Paper Series;2024-04-09

2. Model Order Reduction of a Microelectronic Package Subjected to Temperature Cycling and Vibration Test;2024 25th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE);2024-04-07

3. Photoelastic analysis of crack terminating at an arbitrary angle to the bimaterial interface under four point bending;Theoretical and Applied Fracture Mechanics;2023-10

4. The Effect of Reflow Process on the Physical Properties of Die Attach Adhesives;Procedia Engineering;2016

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