Microstructure and tensile properties of Sn–1Cu lead-free solder alloy produced by directional solidification-Reference-Cited by-同舟云学术

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Microstructure and tensile properties of Sn–1Cu lead-free solder alloy produced by directional solidification

Published:2012-10 Issue: Volume:556 Page:816-823
ISSN:0921-5093
Container-title:Materials Science and Engineering: A
language:en
Short-container-title:Materials Science and Engineering: A

Author:

Hu Xiaowu,Chen Wenjing,Wu Bin

Funder

China Postdoctoral Science Foundation

Nature Science Foundation of Jiangxi province

Science and Technology project of Jiangxi Department of Education

Publisher

Elsevier BV

Subject

Mechanical Engineering,Mechanics of Materials,Condensed Matter Physics,General Materials Science

Reference14 articles.

1. Influence of small amount of Al and Cu on the microstructure, microhardness and tensile properties of Sn–9Zn binary eutectic solder alloy

2. Suppressing the growth of Cu–Sn intermetallic compounds in Ni/Sn–Ag–Cu/Cu–Zn solder joints during thermal aging

3. Nanomechanical responses of intermetallic phase at the solder joint interface – Crystal orientation and metallurgical effects

4. Effects of Zn addition and aging treatment on tensile properties of Sn–Ag–Cu alloys

5. Influence of temperature and strain rate on tensile properties of single walled carbon nanotubes reinforced Sn–Ag–Cu lead free solder alloy composites

Cited by 34 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Effect of Mold Material and Solidification Conditions on Microstructural and Mechanical Properties of Directionally Solidified Sn-0.7Cu Alloy Developed Using Microwave Energy;Journal of Materials Engineering and Performance;2024-06-21

2. Phase selection and nano-mechanical properties of intermetallic compounds in directionally solidified Cu-68at.%Sn peritectic alloy;Journal of Alloys and Compounds;2021-04

3. Effect of graphene nano-sheets additions on the density, hardness, conductivity, and corrosion behavior of Sn–0.7Cu solder alloy;Journal of Materials Science: Materials in Electronics;2019-11-20

4. Influence of Bi Addition on Pure Sn Solder Joints: Interfacial Reaction, Growth Behavior and Thermal Behavior;Journal of Wuhan University of Technology-Mater. Sci. Ed.;2019-06

5. Structure and properties of Sn-Cu lead-free solders in electronics packaging;Science and Technology of Advanced Materials;2019-05-07

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