Effects of aging treatment on mechanical properties and microstructure of Sn–8.5Zn–0.5Ag–0.01Al–0.1Ga Solder

Author:

Hsuan Teng-Chun,Lin Kwang-Lung

Publisher

Elsevier BV

Subject

Mechanical Engineering,Mechanics of Materials,Condensed Matter Physics,General Materials Science

Cited by 25 articles. 订阅此论文施引文献 订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献

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3. Influence of aging on microstructure and hardness of lead-free solder alloys;Soldering & Surface Mount Technology;2020-07-08

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