An investigation of workability and flow instability of Sn-5Sb lead free solder alloy during hot deformation
Author:
Publisher
Elsevier BV
Subject
Mechanical Engineering,Mechanics of Materials,Condensed Matter Physics,General Materials Science
Reference39 articles.
1. Research and prospect of binary high-temperature Pb-free solders;Du;Solder. Surf. Mt. Technol.,2015
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3. Lead (Pb)-free solders for electronic packaging;Kang;J. Electron. Mater.,1994
4. Microstructural evolution and tensile properties of Sn–5Sb solder alloy containing small amount of Ag and Cu;El-Daly;J. Alloy. Compd.,2011
5. Creep properties of Sn–Sb based lead-free solder alloys;El-Daly;J. Alloy. Compd.,2009
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