Effect of copper addition on the microstructure and mechanical properties of lead free solder alloy
Author:
Publisher
Elsevier BV
Subject
Mechanical Engineering,Mechanics of Materials,Condensed Matter Physics,General Materials Science
Reference26 articles.
1. Effects of Co and Ni addition on reactive diffusion between Sn–3.5Ag solder and Cu during soldering and annealing
2. Tensile properties of Sn–Ag based lead-free solders and strain rate sensitivity
3. Role of Electrode Potential Difference between Lead-Free Solder and Copper Base Metal in Wetting
4. Metallurgy of low temperature Pb-free solders for electronic assembly
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1. Effect of Co on microstructure evolution and thermal fatigue stability of lead-free solder alloys of SACBSN series;Microelectronics Reliability;2024-06
2. Effect of Au thin films thickness on the wetting characteristics of eutectic Pb-Sn solder on Ni/Ag solder bath;Materials Today Communications;2023-08
3. The effect of Ag on the growth of intermetallics at the interface of Sn5Zn/Cu interconnects;Materials Today Communications;2020-09
4. Study of Electromigration Failure in Solder Interconnects under Low Frequency Pulsed Direct Current Condition;2020 IEEE 70th Electronic Components and Technology Conference (ECTC);2020-06
5. Effect of Bismuth Addition on Physical Properties of Sn-Zn Lead-Free Solder Alloy;Journal of Electronic Materials;2019-09-05
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