Mixed mode fracture toughness of lead–tin and tin–silver solder joints with nickel-plated substrate
Author:
Publisher
Elsevier BV
Subject
Mechanical Engineering,Mechanics of Materials,Condensed Matter Physics,General Materials Science
Reference29 articles.
1. Mixed Mode Cracking in Layered Materials
2. Fracture of a ductile layer constrained by stiff substrates
3. Mixed mode I/II fracture and fatigue crack growth along 63Sn–37Pb solder/brass interface
4. Investigation of long-term reliability and failure mechanism of solder interconnections with multifunctional micro-moiré interferometry system
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2. Structural and mechanical analyses of soldering materials containing Pb, Sn, Ag, Cu, Bi and Zn;Materials Today: Proceedings;2021
3. Failure of intermetallic solder ball due to stress shielding and amplification effects;Handbook of Materials Failure Analysis;2020
4. Interfacial fracture toughness of sintered hybrid silver interconnects;Journal of Materials Science;2019-12-01
5. Microstructure and size effect of interfacial intermetallic on fracture toughness of Sn3.0Ag0.5Cu solder interconnects;Engineering Fracture Mechanics;2018-10
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