Microstructure evolution and interfacial failure mechanism in 316LSS diffusion-bonded joints-Reference-Cited by-同舟云学术

Microstructure evolution and interfacial failure mechanism in 316LSS diffusion-bonded joints

Published:2008-09 Issue:1-2 Volume:491 Page:488-491
ISSN:0921-5093
Container-title:Materials Science and Engineering: A
language:en
Short-container-title:Materials Science and Engineering: A

Author:

Li Shu-Xin,Xuan Fu-Zhen,Tu Shan-Tung,Yu Shu-Rong

Publisher

Elsevier BV

Subject

Mechanical Engineering,Mechanics of Materials,Condensed Matter Physics,General Materials Science

Reference18 articles.

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3. Ultra-high-density interconnection technology of three-dimensional packaging

4. Feasibility study on the applicability of a diffusion-welded compact intermediate heat exchanger to next-generation high temperature gas-cooled reactor

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