Structure-property models in Al-Zn-Mg-Cu alloys: A critical experimental assessment of shape castings
Author:
Funder
Discovery Grant program
Publisher
Elsevier BV
Subject
Mechanical Engineering,Mechanics of Materials,Condensed Matter Physics,General Materials Science
Reference50 articles.
1. Microstructure and strengthening of A-Li-Cu-Mg alloys and MMC: I. analysis and modeling of microstructural changes;Starink;Acta Mater.,1999
2. Microstructure and strengthening of A-Li-Cu-Mg alloys and MMC: II. Modeling of yield strength;Starink;Acta Mater.,1999
3. The effects of a trace addition of silver upon elevated temperature ageing of an Al+Zn+Mg alloy;Maloney;Micron,2001
4. Light Alloys from Traditional Alloys to Nano-crystals;Polmear,2006
5. Material Science and Engineering: An Introduction;Calister,2010
Cited by 31 articles. 订阅此论文施引文献 订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献
1. The influence of Zn addition on the microstructure and mechanical and corrosion properties of warm rolled Al Mg alloys containing Er and Zr;Materials Characterization;2024-11
2. Revisiting Ag addition in 7xxx aluminum alloys: Insights into its impact on the microstructure and properties of an Al-Zn-Mg-Cu-Zr alloy with a Zn/Mg ratio of 4;Materials Characterization;2024-09
3. Effect of Ag content and extrusion on the microstructure and mechanical properties of Mg–Ag alloys;Journal of Materials Research and Technology;2024-05
4. Precipitation and Corrosion Behaviors of Al-Zn-Mg-Cu Alloys with the Coupled Soft/Hard Micro-Areas;2024
5. Effects of Mg/Zn ratio and pre-aging on microstructure and mechanical properties of Al–Mg–Zn–Cu alloys;Journal of Materials Research and Technology;2023-11
1.学者识别学者识别
2.学术分析学术分析
3.人才评估人才评估
"同舟云学术"是以全球学者为主线，采集、加工和组织学术论文而形成的新型学术文献查询和分析系统，可以对全球学者进行文献检索和人才价值评估。用户可以通过关注某些学科领域的顶尖人物而持续追踪该领域的学科进展和研究前沿。经过近期的数据扩容，当前同舟云学术共收录了国内外主流学术期刊6万余种，收集的期刊论文及会议论文总量共计约1.5亿篇，并以每天添加12000余篇中外论文的速度递增。我们也可以为用户提供个性化、定制化的学者数据。欢迎来电咨询！咨询电话：010-8811{复制后删除}0370
www.globalauthorid.com
TOP
Copyright © 2019-2024 北京同舟云网络信息技术有限公司 京公网安备11010802033243号 京ICP备18003416号-3