Thermal cycle response of a lead-free solder reinforced with adaptive shape memory alloy
Author:
Publisher
Elsevier BV
Subject
Mechanical Engineering,Mechanics of Materials,Condensed Matter Physics,General Materials Science
Reference35 articles.
1. Damage accumulation under repeated reverse stressing of Sn-Ag solder joints
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3. Underfill constraint effects during thermomechanical cycling of flip-chip solder joints
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4. Thermal fatigue behaviors of Sn–4Ag/Cu solder joints at low strain amplitude;Materials Science and Engineering: A;2013-09
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